Leanplans sponsored the successful Shenzhen–Hong Kong joint event by CCF & YOCSEF: ‘Deepseek and the Future of Technology.
On February 22, 2025, the tech event “Deepseek and the Future: Club on Emerging Technologies and Implementation,” sponsored by Shenzhen Leanplans Technology Co., Ltd. (brand: Leanplans), was successfully held at Tsinghua Shenzhen International Graduate School.
Jointly organized by CCF YOCSEF Shenzhen and Hong Kong chapters, the event brought together leading experts from academia and industry. As the sole sponsor, Leanplans joined hands with participants to explore breakthroughs in AI foundation models, multimodal technologies, and automation engineering — driving innovation and accelerating the application of cutting-edge technologies across industries.
▍Distinguished Experts Gather to Share Insights on the Future
The event brought together renowned experts, including Professor Yuan Chun (Tsinghua University), Professor Qiu Xipeng (Fudan University), Professor Cheng Mingming (Nankai University), Professor Wang Benyou (The Chinese University of Hong Kong, Shenzhen), and Mr. Liu Dongping (Director at Amazon), along with dozens of other esteemed guests. They engaged in in-depth discussions on the core breakthroughs and industrial applications of Deepseek technology.
Professor Yuan shared optimization strategies for large models through reinforcement learning, proposing a multi-policy fusion framework to advance logical reasoning capabilities.
Professor Cheng explored high-efficiency image generation, forecasting that multimodal AI will reshape the creative landscape.
Director Liu highlighted fully automated software engineering practices, emphasizing that “solving complex problems at low cost” will be a key competitive advantage in the future.
The discussions also focused on high-value application scenarios such as healthcare, manufacturing, and finance, exploring pathways to close the loop from technology innovation to commercialization.
Participants further exchanged insights on open-source ecosystems, hardware compatibility, and ethical compliance — driving the inclusive and responsible deployment of advanced technologies.
Technology × Industry: How can we escape the dilemma where “more users mean greater losses”? Experts proposed a dual approach: open-source cost reduction and deep integration into real-world scenarios.
Academia × Application: Disruptive innovation stems from fundamental research — only through industry-academia collaboration can we bridge the gap from theory to product.
Future × Responsibility: AI must balance efficiency with human-centered care, addressing ethical challenges such as copyright boundaries and accountability in medical decisions.
▍Technological Breakthroughs: How Mixture-of-Experts Models Tackle Manufacturing Challenges
The Leanplans–Harbin Institute of Technology (Shenzhen) Joint Lab unveiled a series of AI-driven innovations:
Zero-shot Cold Start: In the design of non-standard components for 3C products, AI automatically generates a manufacturability evaluation report from 3D models within just 10 seconds — achieving 92% accuracy, compared to traditional manual evaluations that can take dozens of hours.
Multimodal Interaction: Engineers input requirements using natural language and hand-drawn sketches. The system outputs ISO-compliant engineering drawings automatically, reducing design iteration cycles from 7 days to just 8 hours.
Global Supply Chain Optimization: By dynamically matching orders across thousands of machines on the “Leanplans Work Order” platform, urgent orders from North American clients saw lead times drop from 35 days to 16 days.
▍Leanplans’ Triple Value Proposition for the Industry
Technological Value: Enabling the flow of manufacturing knowledge
By leveraging AI large models, we have consolidated over 200,000 component design and manufacturing knowledge nodes, creating a “dynamic knowledge graph” for the manufacturing industry.Ecological Value: Connecting global production capacities
The platform has aggregated over 3,000 processing machines, covering 12 manufacturing processes such as CNC machining and 3D printing, enabling 24-hour rapid production.Social Value: Lowering the barriers to innovation
Research teams from universities and scientific institutions have seen an 80% reduction in costs, while small and micro enterprises receive a 50% subsidy on their first prototype orders, embodying the principle of “technology equity.”
▍Leanplans: Accelerating the Future
As a pioneering company dedicated to AI and manufacturing, Leanplans is committed to driving the implementation of cutting-edge technologies. This sponsored event not only highlights the company’s support for building a technological ecosystem but also facilitates seamless collaboration between academic achievements and industrial needs through a cross-sector dialogue platform.
In the future, we will continue to focus on core areas such as artificial intelligence, smart manufacturing, and multimodal interaction, working with our partners to explore new scenarios for technology empowerment!
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